Computer Processor Manufacturing Process

Sand, a quarter of its parts formed from silicon, which is the most abundant chemical element on earth after oxygen. Sand (mainly quartz), has a high percentage of silicon in the form of Silicon Dioxide (SiO2) and the sand is the main ingredient for producing semiconductor.

After obtaining raw of separating sand and silicone, the excess material removed. Then, gradually purified silicon to achieve quality 'semiconductor manufacturing quality', or so-called 'electronic grade silicon'. Purification resulted in something very powerful when 'electronic grade silicon' can only have one 'alien atom' in every one billion atoms of silicon. After purification of the silicon phase is finished, melting silicon phase. From the picture above, we can see how the large-sized crystals that emerged from the melted silicon. The result is a single crystal of the so-called 'Ingot'.

Single crystal 'ingots' is formed from the 'electronic grade silicon'. Large single 'Ingot' roughly 100 Kilograms or 220 pounds, and has a high purity silicon to 99.9999 percent.

After that, 'Ingot' entered the stage of incision. 'Ingot' in thin slices to produce a 'silicon discs', called 'wafers'. Some 'Ingot' can stand up to 5 feet. 'Ingot' also has a different diameter sizes depending on how large the 'wafers' are required. CPU today typically requires a 'wafers' with size of 300 mm.

Once sliced​​, 'wafers' polished up really perfectly smooth, mirror-like surface into a very, very smooth. In fact, Intel does not manufacture its own 'Ingots' and 'wafers', but Intel's purchase of the companies 'third-party'. Intel processors with 45nm technology, using 'wafers' with a size of 300mm (12 inch), while the first time Intel makes chips, Intel is using 'wafers' with a size of 50mm (2 inch).

Blue liquid as shown in the picture above, is 'Photo Resist' as used in the 'Film' in photography. 'Wafers' are played in this stage so that the layers can be uniformly smooth and thin.

In this phase, "Photo Resist 'illuminated light' Ultra Violet '. Chemical reactions that occur in this process is similar to the 'film' camera that happens when we press the shutter (Jepret!).

The most powerful area or stand in 'Wafer' to be flexible and fragile due to the effects of light 'Ultra Violet'. Lighting to be managed by using protective function like a stencil. When exposed to light 'Ultra Violet', a protective coating makes the circuit pattern. Processor in the making, is very important and primary to repeat this process over and over again until the layers above the layer below it, and so on.

Lens in the middle of the light serves to shrink into a smaller focus.

From the picture above, we can picture what if one piece 'Transistor' we see with the naked eye. Transistor acts as a switch, controlling the flow of electric current in the 'Chip' computers. Intel researchers have developed transistors so small that about 30 million 'Transistor' can be lodged at the end of the 'Pin'.

Once exposed to light 'Ultra Violet', field 'Photo Resist' absolutely devastated. The picture above reveals a pattern 'Photo Resist' which created a protective layer. This pattern is the beginning of 'transistors', 'interconnects', and matters relating to electric starts here.

Although the field is destroyed, a layer of 'Photo Resist' still protect the material 'Wafer' so it will not tersketsa. The part that is not protected will etched with chemicals.

After tersketsa, layer 'Photo Resist' is removed and the desired shape becomes visible

'Photo Resist' re-used and irradiated with light 'Ultra Violet'. 'Photo Resist' is illuminated then washed before stepping into the next stage, the washing process is called 'Ion Doping', a process in which the ion particle impact to 'Wafer', so that the chemical properties of silicon was changed, so the CPU can control the electrical current.

Through a process called 'Ion implantation' (part of the process of Ion Doping) silicon area on the 'wafers' shot by the ion. Ions implanted in silicon in order to change between silicon with electrical power. Ion driven to the surface 'Wafer' high speed. The electric field accelerates ions with a velocity of more than 300.000 km / h (about 185.000 mph)

Once ion implanted, "Photo Resist 'is removed, and the material is colored green in the image is now embedded' Alien Atoms'

This transistor is almost complete. Three holes have been draw in the insulating layer (reddish purple), which is above the transistor. Three holes will be filled with copper, which serves to connect these transistors with the other transistor

'Wafers' entered into 'copper sulphate solution' at this level. Copper ions are stored in a transistor through a process called 'Electroplating'. Copper ions runs from the positive terminal (anode) to negative terminal (cathode).

Copper ions have a thin layer on the surface 'wafers'

Smoothed excess material, leaving a very thin layer of copper.

Many are made of metal layers to interconnect the various transistors. How the series connection is connected, it is determined by the architecture and design team that developed the capabilities of each processor. Where the computer chip looks very flat, it actually has more than 20 layers to make the complex circuits. If you see a magnifying glass, you will see the network forms a complex circuit, and transistors that looks futuristic, 'Multi-Layered Highway System'

To Be Continue........